Loaded Board Test Probe
The loaded board test probe is applied for examining the loaded circuit boards. The common testing methods for loaded boards are ICT (In-Circuit Test) and FCT (Function Test). Both methods examine the performance of components and circuit connections to detect the defective components during production. ICT and FCT ensure the loaded circuit boards’ normal operation through assessing connection performance of the testing components at the replicated environment of the future application field and controlling the electrical performance of the components to assess the comprehensive connection of the circuit.
To complete ideal testing, different types of probes can be used. The probes are differentiated by the installation length, the possible spaces between the probes, the tip forms, and the interfaces. The final testing can be performed together with the combination of melding module and wound-rotor wire wrap connector in wired or wireless forms and be able to detect approximately 90% of defects.
